Antenna in Package

Dual polarization, dual band and miniaturized 5G mobile antenna is realized by combining basic 1x4 patch array (Broadside) and 1x4 dipole array (End-fire). Broadside uses Reactive Impedance Surface (RIS) and end-fire uses vertically folded dipole antenna to maximize gain and bandwidth performance. Additionally, the antenna's performance is improved by using a very small and thin metasurface that can be mounted on a smartphone. Inserting this metasurface directly under the antenna and smartphone case improves the beam coverage of the smartphone in the 5G/6G band. Since the inserted metasurface, antenna, and smartphone case are designed to be combined from the initial stage, the radiation performance of the smartphone can be maximized.

Coupled feed structure using coupling between antenna and feed is applied due to high losses at high frequencies. The beam patterns are different depending on the arrangement and number of antennas of Tx and Rx. The Reactive Impedance Surface (RIS) can be used to make the beam pattern into a desired shape and increase gain by adjusting the impedance of the antenna close-up space. By designing a metasurface that compensates the phase just below the case cover, it is possible to solve the problem of antenna beam distortion and gain degradation due to amplitude and phase variations in the case due to the permittivity.

We develop display-integrated 5G mm-Wave antenna. Unlike precedent studies, antenna is directly integrated with and tightly coupled to the metallic display panel. By doing so, it is expected that display visibility and touch sensor sensitivity will be greatly improved along with achieving high radiation efficiency.

A 140 GHz wideband array antenna-in-package is developed based on the low profile multilayer printed circuit board, which can be incorporated with flip-chip technology and an integrated transceiver. Using multiple resonances, a simulated impedance bandwidth of 53% and stable radiation performance over the operating band are achieved.