Byeongjin Kim > Researchers | 서울대학교 전자파 융합 연구실

International Journals

B. Kim, J. Jung, S. Yun, H. Kim, and J. Oh, "Heterogeneous Metasurface Empowering Proximate High-Permittivity Ceramic Cover For a 5G Dual-Band Millimeter-Wave Smartphone," IEEE Trans. Antennas Propag., vol. 72, no. 5, pp. 4086-4094, May 2024, doi: 10.1109/TAP.2024.3383725.
S. Bang, T. Yoon, B. Kim, J. Oh, H. Kim and J. Oh, "Extremely Miniaturized Free-Space Measurement System for RF Metamaterial Composite Based on Beam Focusing Transmitarray," IEEE Antennas Wireless Propag. Lett., vol. 23, no. 6, pp. 1705-1709, June 2024, doi: 10.1109/LAWP.2024.3367497.
B. Kim and J. Oh, "Single-Glass Layer Optically Transparent Transmitarray With High Aperture Efficiency And Low Profile At 5G Millimeter-Wave Band," IEEE Trans. Antennas Propag., vol. 71, no. 11, pp. 9036-9041, Nov. 2023, doi: 10.1109/TAP.2023.3305876.
[Top Access, Jan. 2024]
[Special Article Collection on Emerging 5G/6G Communication (75th AP-Society's anniversary)*]
(*1) https://ieeeaps.org/ieee-tap/special-issues/antennas-and-propagation-for-emerging-5g-6g-communications
(*2) F. Falcone, M. Khalily, Z. N. Chen, T. Rappaport and P. Rocca, "Editorial Special Article Collection on Antennas and Propagation for Emerging 5G/6G Communications," IEEE Trans. Antennas Propag., vol. 72, no. 8, pp. 6173-6176, Aug. 2024, doi: 10.1109/TAP.2024.3428288.
H. Kim, S. Oh, S. Bang, H. Yang, B. Kim, and J. Oh, "Independently Polarization Manipulable Liquid-Crystal-Based Reflective Metasurface for 5G Reflectarray and Reconfigurable Intelligent Surface," IEEE Trans. Antennas Propag., vol. 71, no. 8, pp. 6606-6616, Aug. 2023, doi: 10.1109/TAP.2023.3283136.
J. Oh, B. Kim (co-first authors), S. Yoon, K. Kim, E. Sung, and J. Oh, "High Gain Millimeter Wave Antenna-in-Display for 5G Smartphones," IEEE Trans. Antennas Propag., vol. 71, no. 2, pp. 1458-1468, Feb. 2023, doi: 10.1109/TAP.2022.3228912.

International Conferences

B. Kim and J. Oh, "Characterization of Optically Transparent Two-Metal-Layered Refractive Metasurfaces for 6G Upper-Mid Outdoor-to-Indoor Communication," 2024 IEEE International Symposium on Antennas and Propagation and INC/USNC‐URSI Radio Science Meeting (AP-S/INC-USNC-URSI), Firenze, Italy, 2024, pp. 1363-1364.

Domestic Conferences

B. Kim and J. Oh, "Dual-Band Proximate Metasurface for Ceramic Covered 5G Millimeter-Wave Smartphone," in KIEES Winter Conference, Feb. 2024.
B. Kim and J. Oh, "High Efficiency and Low Profile Millimeter-Wave Transmitarray With Double Metal Layers," in KIEES Winter Conference, Feb. 2023.
B. Kim and J. Oh, “Low-cost, Low-profile Dual-band Transmitarray Design for 5G Millimeter-wave Applications,” in KIEES Winter Conference, Feb. 2022.
B. Kim, S. Yoon, S. Cheon and J. Oh, “Investigation into The Performance of Novel Proximity Coupled Antenna for Potential Display integrated Antenna Applications,” in KIEES Summer Conference, Aug. 2021.
B. Kim, S. Yoon, J. Kim and J. Oh, “Low Profile Display Integrated Antenna Concept for Millimeter Wave 5G Devices” in KIEES Winter Conference, Feb. 2021.
B. Kim and J. Oh, “5G Dual-Band Co-polarized Metasurface Design” in the 1st Undergraduate Exhibition Competition held in KIEES Summer Conference, Aug. 2020. (Best Paper Award)

Patents

U.S. Patent Application 17/365,017, Jul. 1, 2021. (Registration number: 11662782, May. 30, 2023)
CN Patent Application 202110929770.4, Aug. 13, 2021.
U.S. Patent Application 17/462,813, Aug. 31, 2021.
CN Patent Application 202111577726.8, Dec. 22, 2021.
U.S. Patent Application 17/647,140, Jan. 5, 2022. (Registration number: 11793052, Oct. 17, 2023)
U.S. Patent Application 17/835,342, Jun. 8, 2022. (Registration number: US11831069, Nov. 28, 2023)
U.S. Patent Application 17/861,517, Jul. 11, 2022.
CN Patent Application 202211089974.2, Sep. 07, 2022.
CN Patent Application 202211264945.5, Oct. 17, 2022.
U.S. Patent Application 17/983,333, Nov. 7, 2022.
CN Patent Application 202211671042.9, Dec. 26, 2022.
U.S. Patent Application 18/470,135, Sep. 19, 2023.
U.S. Patent Application 18/382,098, Oct. 20, 2023.
EP Patent Application 24158163.6, Feb. 16, 2024.
CN Patent Application 202410183991.5, Feb. 19, 2024.
U.S. Patent Application 18/610,004, Mar. 19, 2024.
CN Patent Application 202410883379.9, Jul. 3, 2024.