Research Interest
Intra-System EMI/EMC & RFI Mitigation,
Electromagnetic Co-Design for Advanced Packaging (2.5D/3D, HBM),
Compact / Multi-Band Antenna Design for 5G/6G Smartphones
Electromagnetic Co-Design for Advanced Packaging (2.5D/3D, HBM),
Compact / Multi-Band Antenna Design for 5G/6G Smartphones